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            CIS

            ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

            AUTOPIA

            Automatic Active Alignment System (for Automotive Camera Application)

            COSMOS

            Automatic 3D Sensing Alignment System

            Eagle AERO

            For High-end IC Applications

            Lens Holder Attach System

            IS600GS

            Automatic Active Alignment Bonding System for Camera Module Assembly

            Lens Holder Attach System

            IS868LA3

            Automatic Lens Holder Attach System

            DI-water Cleaning System

            ISCM868S

            Automatic DI-Water Cleaning System

            ISLinDA

            Automatic Die Bonding System (12” wafer handling)

            Ball Bonder OPTO/LED Wire Bonding Equipment

            Harrier Xtreme

            Dual-Head Extreme High Speed Wire Bonder

            OPTO/LED Wire Bonding Equipment

            iHawk Xpress XL

            Wire Bonder

            Ball Bonder OPTO/LED Wire Bonding Equipment

            iHawk Xtreme

            Wire Bonder

            Other Applications

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