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            Group Structure

            • ASM Pacific Technology
                • Wire bonders
                • Die bonders
                • Encapsulation solutions
                • Test handlers
                • Clip bonders,
                • CIS ?equipment
                • TCB bonders
                • Flip chip bonders
                • Mold Under Fill (MUF)
                • Panel molding
                • Laser grooving and dicing
                • Leadframes
                • Advanced packaging materials (molded interconnect substrates)
                • Assembly line solutions
                • DEK printing systems
                • SIPLACE placement systems
                • ASM smart factory tools & services
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